ebeam Technologies announces ebeam Core 100/760 optimized for HP Indigo 20000 finishing
Global launch at HP Indigo customer event in Israel
Flamatt, Switzerland, February 19th, 2018
– ebeam Technologies, the developer and manufacturer of electron beam (ebeam or EB) solutions today launched its ebeam Core 100/760
, an EB curing system for high performance finishing of labels and flexible packaging materials printed on an HP Indigo 20000 Digital Press. The performance of the ebeam Core 100/760 was successfully demonstrated on a GM coating unit at the HP Indigo Worldwide VIP Event in Israel in Feb 2018.
Optimized for over-print varnish applications on the HP Indigo 20000 Digital Press, the ebeam Core 100/760 delivers numerous competitive advantages to HP Indigo digital press users: ebeam curing is effectively instant and offers the production of safe indirect food-contact packaging – enabling fast time to all markets.
ebeam curing produces an outstanding look and feel with high-gloss, matte and soft-touch finishes that are scratch, tear, puncture and fade resistant, resulting in substantially increased package durability and abrasion resistance. Finished materials have increased heat resistance, which enables heat-sealing to form pouches and, as it is a room-temperature process, heat sensitive substrates can be easily cured. The ebeam curing system can also be used to perform a Cast & Cure process, delivering hologram effects that make finished products stand out on store shelves.
ebeam acts as a comprehensive cure for food-safe indirect food-contact packaging because it eliminates the need for photoinitiators, removing the risks associated with their migration. It also offers other important health, environmental and sustainability benefits that help printers achieve their sustainability and environment improvement targets, such as low energy requirements and the production of virtually no VOC emissions.
“The combination of HP Indigo 20000 and ebeam Core 100/760 with either an inline or near line coating unit is a perfect fit for surface print flexible packaging, such as Form Fill Seal reel-fed lidding applications, which require highly demanding and durable protection for HP Indigo ElectroInks,” said Mach Machikawa, HP Indigo global flexible packaging segment manager. “The potential for faster turnaround times, new market opportunities through high value-added embellishment, and sustainability offer HP Indigo 20000 users a genuine competitive edge.”
“Our ebeam Core 100/760 solution is based on a simple design originated from our proven and reliable ebeam Core series. It has an integrated shield roll for web support and, thanks to electron beam technology’s considerably lower energy consumption, is cost effective to operate,” said Elsa Callini, Business Development Manager at ebeam Technologies. “By addressing many important flexible packaging challenges, including fast turnaround times, environmental factors and traditional barriers to the safe production of indirect food-contact flexible packaging – we believe we have a promising solution for finishers and converters.”